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Shares of a leading Chinese display panel manufacturer surged by the maximum allowed trading limit for a second consecutive day, despite the company denying any collaboration with a prominent U.S. semiconductor company. The stock closed up 10% at 5.16 Chinese yuan (roughly 76 cents USD) in Shenzhen today.
The company clarified that it currently has no business partnerships with the American firm and dismissed media reports suggesting otherwise, stating these claims lacked factual basis.
On May 20, the company announced a collaboration with a major U.S. materials firm to develop new products, including optical interconnects. Some reports incorrectly assumed this partnership signaled an entry into the U.S. company’s supply chain, given their shared focus on optical communications.
This partnership aims to advance four innovative application areas: glass-based packaging substrates, foldable glass, perovskite glass substrates, and optical interconnects. Additionally, the involved U.S. companies are planning to construct three state-of-the-art manufacturing facilities in North Carolina and Texas dedicated to developing optical communication technologies.
The company emphasized that its glass packaging substrates, perovskite glass, and optical interconnect initiatives are still in the research and development phase. They have not yet reached commercial production or generated revenue. The company also highlighted significant uncertainties regarding the timeline and profitability of mass production for these projects.
According to the current outlook, these new ventures are unlikely to influence the company’s financial performance over the next two to three years.
Glass substrates are considered vital for next-generation packaging technology, offering notable advantages over traditional materials. For example, they significantly reduce warpage caused by high temperatures—by more than 70% compared to organic substrates—which helps address common mechanical failure issues in AI chip packaging.





