As Apple continues to roll out its M4 chips, we’re getting an exciting glimpse into what the next generation, the M5, will offer. Renowned analyst Ming-Chi Kuo shared insights today via X, detailing significant technical advancements on the horizon.
The upcoming M5 series will be built using TSMC’s advanced N3P process, marking a step forward from the N3E node used in the M4 chips. Kuo informs us that this new manufacturing method entered its prototype stage a few months ago, making it the first time we will see three consecutive generations of chips produced on a 3nm node.
The M5 Pro, Max, and Ultra versions are set to utilize “server-grade” 2.5D packaging aimed at boosting production efficiency and enhancing thermal management. This innovative design will separate the CPU and GPU architectures, a shift from the typical system-on-chip layouts seen in prior models. Kuo also notes that these advanced M5 processors will be particularly advantageous for artificial intelligence tasks.
The Apple M5 series chip:
1. The M5 chips will leverage TSMC’s cutting-edge N3P node, which recently entered prototyping. Mass production for M5, M5 Pro/Max, and M5 Ultra is projected for 1H25, 2H25, and 2026, respectively.
2. The M5 Pro, Max, and Ultra will utilize… https://t.co/XIWHx5B2Cy— Ming-Chi Kuo (@mingchikuo) December 23, 2024
While many specifics remain under wraps, it is evident that Apple is equipping its higher-end chips with new features and capabilities. According to Kuo’s timeline, the M5 series is expected to debut in early 2025, with the M5 Pro/Max appearing later that year, and the top-tier M5 Ultra launching in 2026. This release schedule suggests a return to a more regular update pattern for the most robust Mac desktops after a hiatus with the M3 Ultra.
In the meantime, we await the M4 Ultra’s arrival in refreshed Mac Studio and Mac Pro models anticipated for release in 2025.
