Select Language:
As Apple continues to roll out its M4 chips, we’re getting an exciting glimpse into what the next generation, the M5, will offer. Renowned analyst Ming-Chi Kuo shared insights today via X, detailing significant technical advancements on the horizon.
The upcoming M5 series will be built using TSMC’s advanced N3P process, marking a step forward from the N3E node used in the M4 chips. Kuo informs us that this new manufacturing method entered its prototype stage a few months ago, making it the first time we will see three consecutive generations of chips produced on a 3nm node.
The M5 Pro, Max, and Ultra versions are set to utilize “server-grade” 2.5D packaging aimed at boosting production efficiency and enhancing thermal management. This innovative design will separate the CPU and GPU architectures, a shift from the typical system-on-chip layouts seen in prior models. Kuo also notes that these advanced M5 processors will be particularly advantageous for artificial intelligence tasks.
The Apple M5 series chip:
1. The M5 chips will leverage TSMC’s cutting-edge N3P node, which recently entered prototyping. Mass production for M5, M5 Pro/Max, and M5 Ultra is projected for 1H25, 2H25, and 2026, respectively.
2. The M5 Pro, Max, and Ultra will utilize… https://t.co/XIWHx5B2Cy— Ming-Chi Kuo (@mingchikuo) December 23, 2024
While many specifics remain under wraps, it is evident that Apple is equipping its higher-end chips with new features and capabilities. According to Kuo’s timeline, the M5 series is expected to debut in early 2025, with the M5 Pro/Max appearing later that year, and the top-tier M5 Ultra launching in 2026. This release schedule suggests a return to a more regular update pattern for the most robust Mac desktops after a hiatus with the M3 Ultra.
In the meantime, we await the M4 Ultra’s arrival in refreshed Mac Studio and Mac Pro models anticipated for release in 2025.
Add us on ChatGPT
Add us on Perplexity
