AMD Flagship GPUs To Return With RDNA Successor

Select Language:

A recent revelation from the Chiphell forums has shed light on AMD’s ambitious strategies for its next-generation CPU and GPU architectures. A post by forum contributor zhangzhonghao states that AMD is planning to implement TSMC’s advanced N3E process node in its forthcoming line of Radeon GPUs and potentially for future CPUs as well.

This leakage emphasizes the development of GPUs built on the innovative UDNA architecture, designed to replace the existing RDNA framework. Among these new GPUs is expected to be a flagship model, aimed at rivaling Nvidia’s elite GeForce RTX offerings, which would fill a significant gap in AMD’s current RDNA 4 range.

AMD affirmed its commitment to UDNA during last year’s IFA, indicating it will cater to both gaming and enterprise markets. This new unified architecture aims to streamline development by merging the previously separate RDNA and CDNA architectures into a cohesive design. This consolidation should enhance software optimization across all AMD GPUs, addressing previous inefficiencies in the hierarchy.

Utilizing TSMC’s N3E node, an upgraded version of the 3nm process, signals AMD’s dedication to improving both performance and efficiency. This cutting-edge technology is poised to enhance transistor density and power management capabilities, contributing to improved gaming and computing power. Furthermore, the UDNA architecture may introduce advancements tailored for ray tracing and AI tasks, areas where AMD has historically trailed behind rivals.

On the CPU front, the leak indicates that AMD intends to leverage TSMC’s N3E process node for its upcoming Zen 6 CPU chiplets, while the N4C node is anticipated for the next-generation input/output dies. This shift to more advanced lithography coupled with architectural innovations suggests that the next iteration of AMD CPUs could yield significantly better performance compared to prior generational updates.

Additionally, the post reveals AMD’s plans for additional X3D chips, notably the next-gen Halo, a successor to Strix Halo. The company is looking into implementing 3D V-Cache on both CPU and GPU components, potentially allowing X3D tiles to be incorporated into both chiplet designs and I/O configurations. There is speculation that the next PlayStation 6 APU could feature 3D V-Cache, while Microsoft has yet to finalize its decision regarding the adoption of this technology in future Xbox consoles.