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Taiwan Semiconductor Manufacturing Company (TSMC) is ramping up its production capacity for 2nm chips, with plans to reach an output of 200,000 wafers per month by 2028. This significant expansion reflects TSMC’s commitment to maintaining its leadership in advanced semiconductor manufacturing and meeting growing global demand for next-generation chips. The move is expected to strengthen TSMC’s position in the industry and support the rapid development of applications such as artificial intelligence, high-performance computing, and 5G technology. The company continues to invest heavily in cutting-edge fabrication processes to stay ahead of competitors and cater to the increasing technology needs of various sectors worldwide.
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